Spartech showcases single-component lid technology
Posted by Jenni Spinner, Senior Editor -- Packaging Digest, 10/29/2012 4:28:51 PM
The company is displaying its new 1-Seal lid technology in its PACK EXPO booth. The product creates one component, manufacturered in a single process, that can be capped and sealed by leaving a portion of the label surface on a food container exposed inside the lid. The in-mold label enables brand managers to decorate packages with high-quality graphics, according to the company. Further, the product is said to be 100-percent recyclable, heat tolerant, microwaveable, air- and watertight, and tamper-evident. The technology previously was profiled in Packaging Digest's profile of The Better Bean Co. earlier this year.
PACK EXPO Booth N5111
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