Multitest's solution for 3D packageswWins NPI award
Posted by Jack Mans -- Packaging Digest, 2/25/2013 2:38:58 PM
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that it has been awarded a 2013 NPI Award from Circuits Assembly magazine in the category of Test & Inspection - Functional Test for its InStrip 3D. The award was presented to the company during a Tuesday, February 19, 2013 ceremony that took place at the San Diego Convention Center in California.
The InStrip3D utilizes the experience gained from a well-established installed base of high-parallel InStrip/InMEMS solutions. The architecture of the InStrip allows the configuration of the system to meet the special requirements of partial stack test with respect to the extremely sensitive bare dies.
The integrated test solution uses a Multitest load board, leveraging the industry-leading fabrication capabilities for fine-pitch, high layer count PCBs to support this 0.4 mm pitch array application in a high pin count multi-site configuration. In close cooperation with the customer, the mechanics of the test were redesigned to accommodate the increased forces from the highly dense pogo array of approximately 6000 pins.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
James Quinn, VP Sales and Marketing, commented: "For us this award also recognizes Multitest to be the first equipment supplier to deliver a full turn-key hardware set up for in-process test in 3D assembly. Our unique product portfolio enables us to partner with our customers to develop comprehensive solutions for this emerging packaging technology that we see as a major strategic initiative in the semiconductor industry."