InterPACK 09

When: 07/19/2009 - 07/23/2009

Location: Westin St. Francis, San Francisco United States Of America

The InterPACK '09 Conference aims to promote international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave, MEMS and NEMS- Systems Packaging and Integration. Emerging knowledge, research results, new developments, and novel thermal/mechanical/electrical/materials packaging product concepts in Electronic Packaging Engineering will be presented in unique forums and archived in electronic conference proceedings.
Technical Highlights
Technical information will be presented in unique forums and archived in electronic conference proceedings for future use and reference. This year's conference will provide a forum for exchange of information related to the following areas:
*  Telecommunications
*  Packaging Technology
*  Electrical Design, Simulation and Test
*  Microelectronic Systems
*  Photonics
*  Airborne, Space and Defense Electronic Systems
*  Microelectromechanical Systems (MEMS) and Nanoscale Phenomena in Electronics

Additional information:
Website: http://www.interpackconference.org