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Cutting-edge automation technologies highlighted at PACK EXPO 2013

Cutting-edge automation technologies highlighted at PACK EXPO 2013
Pack Expo PELV 2013

Pack Expo PELV 2013Attendees at this year's PACK EXPO 2013 can learn firsthand about innovative technologies to improve production - such as line integration, cloud computing and mobility on the plant floor - in classroom sessions sponsored by Rockwell Automation and its PartnerNetwork program in Las Vegas, Sept. 23 to 25. The Center for Trends and Technology (CTT) (Booth 1358 in the Central Hall), hosted by the Packaging Machinery Manufacturers Institute (PMMI), will feature speakers and displays from leading technology companies, including Cisco, Endress+Hauser, Jacobs Automation, Microsoft, Motorola, Panduit, ProSoft Technology Group and Spectrum Control.

During each day of the event, manufacturers in food, beverage, life sciences, pharmaceuticals, and household and personal care can attend five one-hour classroom sessions aimed at helping them achieve higher productivity, efficiency and sustainability. Topics covered will include network security, manufacturing convergence, safety, packaging-line integration, energy management, remote asset management, mobility, cloud computing and robotics integration.


"Consumer packaged goods manufacturers face a number of challenges as they work to remain profitable while accommodating ever-changing consumer health, taste and cost preferences," says Mike Wagner, manager, global packaging business at Rockwell Automation. "Our goal with the educational sessions and displays in the CTT is to arm manufacturers with an understanding of new and emerging technologies, and demonstrate how to use them to solve unique production challenges. In addition, the CTT will spark collaboration among manufacturers, OEMs and technology leaders alike, keeping them at the forefront of their industry."


With more than 1,600 exhibitors and an expected 26,000 attendees, PACK EXPO Las Vegas will be North America's most comprehensive resource of the year for packaging and processing innovation.


Among those exhibiting will be a wide variety of OEM Partners, whose innovative machines feature the Rockwell Automation integrated control and information platform, including: Aagard, AFA Systems, ARPAC Group, Bradman Lake Group, Cavanna Packaging Group, Columbia Machine, Delkor Systems, Douglas Machine, Intelligrated, Nercon, NJM Packaging, Osgood Industries, Pearson Packaging Systems, R.A. Jones, Schneider Packaging Equipment, Triangle Package Machinery, vonGAL and Wulftec International. To find an OEM Partner or learn more about the OEM Partner program, visit:


About the Rockwell Automation PartnerNetwork Framework
The Rockwell Automation PartnerNetwork framework offers global manufacturers access to a collaborative network of companies mutually focused on developing, implementing and supporting best-in-breed solutions to achieve plantwide optimization, improve machine performance, and meet sustainability objectives.


For more information on Rockwell Automation at PACK EXPO 2013:

Source: Rockwell Automation


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