Stephen Klump of Nestlé quality assurance center is headlining a special day of presentations on the fast emergence of UV and EB technologies in Printing and Packaging applications, at RadTech 2012, Apr. 30 in Chicago.
At the event, Klump will address "Nestlé's Approach to Packaging Safety and Compliance: Nestlé Inks Guidance Document and the Suisse Ordinance on Inks." In addition to Klump, issues presented at the event include global and regional regulatory requirements, new materials, EB technologies and UV inkjet for flexible packaging and labels.
RadTech 2012 also features a technology exhibition and special sessions on sustainability, LEDs and EHS basics for UV/EB. End users of UV and/or EB may be eligible for discounted or free admission to the event.
Source: RadTech 2012