PACK EXPO International (www.packexpo.com), Oct. 29 to Nov. 2, 2006, will focus on the latest developments in packaging technology and will showcase exhibitors' state-of-the-art advances in packaging machinery, converting machinery, materials, packages and containers and components. PACK EXPO International is a biennial event (every other year), occupying the North and South Halls and Lakeside Center of McCormick Place, Chicago.

The last international show in 2004 attracted 50,000 visitors, including 6,000 foreign attendees from more than 75 countries.

The 2006 show will include the following topic-specific pavilions.

Materials and Containers Pavilion: This pavilion debuted at PACK EXPO Las Vegas 2003 and was a great success. At the 2005 show, the pavilion was increased by 33 percent to satisfy increased exhibitor demand. More than 40,000 sq ft of exhibit space will be dedicated to the latest innovations in materials, containers and converting machinery.

The Showcase of Packaging Innovations(TM) will feature an array of the latest, award-winning packages from a selection of leading packaging organizations from around the world.

The Radio Frequency Identification (RFID) Pavilion will again highlight solutions that meet the requirements of the entire supply chain. Included in the exhibits will be technologies to upgrade conventional lines into RFID-enabled packaging lines capable of applying multipack, case and pallet tags online. Also, view the latest advances designed to verify the presence of tags, write to the tags and validate data on the tags.

Packaging Security Pavilion: This pavilion will focus on packaging initiatives and technologies to protect against bioterrorism, package tampering, counterfeiting and product adulteration. Visit packaging security exhibits from technology and service providers as well as government stakeholders.

Contract Packaging Pavilion: The prominence of contract packaging services in today's vibrant marketplace is recognized by this new attraction. The pavilion is a great starting point for assessing a project and exploring the many possible options provided by contract- packaging partners.

Two shows will also co-locate with PACK EXPO International.

The Food Processing Machinery EXPO will co-locate with PACK EXPO International 2006 and will feature 350-plus exhibiting companies. Food Processing Machinery EXPO will be located on the Upper and Lobby Levels of the Lakeside Center at McCormick Place. The focus of the FPM EXPO will be on the newest developments in processing technology to meet the challenges faced by the industry's food and beverage manufacturers. FPM EXPO exhibitors will demonstrate state-of-the-art equipment in the fruit and vegetable, beverage, canning/freezing, environmental, instrumentation, prepared foods, canmaking, meat, dairy and snackfood industries.

FPM EXPO will attract qualified buyers representing every market segment of the food industry from all corners of the U.S. and more than 75 countries. Visitors will come to see and purchase packaging, the latest in food processing equipment, air and liquid handling and engineering/ architectural, design services, cooling/freezing and instrumentation/controls. FPM EXPO is sponsored and produced by the Food Processing Machinery Association (FPMA).

Converting & Package Printing (CPP) EXPO will be co-located for the first time with PACK EXPO International 2006 on the Lobby Level of Lakeside Center at McCormick Place. Reflecting the new market synergies of the package printing, converting, finishing machinery and supplies industries, CPP EXPO showcases the latest in printing, coating, slitting and other state-of-the-art finishing processes. More than 2,800 converting professionals and nearly 250 exhibiting companies attended CPP EXPO in 2005 in search of equipment, materials and services for streamlining operations and improving quality.

The Conference at PACK EXPO will run Monday through Wednesday and will comprise more than 50 sessions, plus keynote addresses each day.

For more information, visit the website, www.packexpo.com or call the show's organizer, the Packaging Machinery Manufacturers Institute, at 703/243-8555.