MAP blister

The co.'s TEKNIFLEX® modified atmosphere blister is described as the first transparent, thermoformed PCTFE blister that takes the proven barrier properties of two-and three-layer PCTFE laminates beyond those of cold-formed foil. The new structure is said to incorporate one or more of CSP Technologies' Activ-Strips® PE desiccant strips into the rib design of the blister-card, linking every cavity with the desiccant. Thus, the co. says, the patented technology makes it possible to significantly reduce headspace moisture content to extend product shelf life. The co. adds that the desiccant doesn't come in contact with the product and is dust-free.

Tekni-Films, 908/722-4800. www.tekni-films.com

CSP Technologies, 334/887-8300. www.csptechnologies.com