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Pack Expo 2014: Day 3 in pictures

There was a constant flow of attendees in Day 3 as in Day 2 as seen in the central atrium area of Chicago's McCormick Place.

Automation advances, flexible packaging innovations and a celebration of packaging leaders marked some of Pack Expo International 2014 Day 3 highlights.

The crowd inside McCormick Place on Day 3 is a repeat performance of Day 2's heavy traffic.

LiquiGlide demo and update including a disclosure of the first expected U.S. application of the hyper-slippery coating.

Delkor's robotic pouch-casing system exemplifies a revolution in standalone robots as well as those integrated into OEM systems like this.

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