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Packaging innovations abound in pavilion

Brand owners looking for their next breakthrough ideas should be sure to visit The Showcase of Packaging Innovations™, located on the lower level of the Lakeside Center.
Sponsored for the third consecutive year by The Dow Chemical Co., the pavilion will highlight more than 300 award-winning packaging designs from these internationally recognized packaging associations:

•ABRE–Brazilian Packaging Association, ABRE Design and Packaging Award
•Asociacion Mexicana de Envase
y Embalaje (AMEE), Stellar Packaging Awards (Certamen Envase Estelar AMEE
•DuPont Authentication, 20th DuPont Awards for Packaging Innovation
•Flexible Packaging Association, Flexible Packaging Achievement Awards
•Glass Packaging Institute, Clear Choice Awards
•Healthcare Compliance Pack-aging Council, Compliance Package of the Year
•Instituto Argentino Del Envase, Estrella del Sur
•In-Mold Decorating Association, IMDA Awards Competition
•Institute of Packaging Professionals (IoPP), AmeriStar Packaging Competition
•Japan Packaging Institute, Japan Packaging Contest
•National Association of Container Distributors, NACD Packaging Awards Competition
•Packaging and Labeling Gravure Association, Print Quality Awards Program
•Paperboard Packaging Council,  National Paperboard Packaging Competition

“We’re pleased to work with Dow Chemical once again to showcase the exciting packaging helping consumers in their every day lives,” says Charles D. Yuska, president/CEO of the Packaging Machinery Mfrs. Intitute [PMMI(www.packexpo.com)].

“The Showcase of Packaging Innovations offers attendees a chance to be inspired by award-winning packaging that represents a full range of market segments and regions.”

The pavilion also houses the third annual PACK EXPO Selects awards program, a feature display and electronic-voting program that allows attendees to vote on their favorite packaging projects. Each eligible project was developed, produced or executed by an exhibitor at PACK EXPO International.

PACK EXPO International 2008 runs November 9-13 at McCormick Place, Chicago, IL USA. 

To find out more, go to Packaging Digest’s PACK EXPO website.

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