Packaging Educators Meet at PACK EXPO to Plan Forum
January 29, 2014
Michigan State University’s School of Packaging invited packaging educators from across the country to convene for a luncheon meeting toward establishing a Packaging Educators Forum to be held annually at PACK EXPO in both Chicago and Las Vegas. “It is my intention that this planning meeting culminate in a strong commitment and solid plan to move forward so that packaging educators have an annual gathering to address important issues facing our institutions and roles,” says Peggy Nuerenberg, MSU School of Packaging coordinator, outreach education programs. “It has been many years since such a venue has been available, and the value of coming together to explore bridges to collaboration, sharing research advances and initiatives and educational resources can be an invaluable tool in strengthening all programs.”
Topics included logistics, format and program length, content and concepts, selection of a title for the event, timing, date and place and sponsorship and organization responsibilities. Other topics in the agenda were sought by the group.
“The level of interest in this event has been incredible,” says Nuerenberg. “More than 30 people from colleges across the country attended. We’re looking forward to this becoming a key event on faculty academic calendars every time PACK EXPO comes around” says Nuerenberg.
To learn more about the Packaging Education Forum, and participation details, contact Nurenberg at MSU at 517/353-6797 or [email protected].
PACK EXPO International 2008 runs November 9-13 at McCormick Place, Chicago, IL USA.
To find out more, go to Packaging Digest’s PACK EXPO website.
You May Also Like