Sponsored By

January 29, 2014

1 Min Read
Software

The co. releases its TIPS® System software version 7.0 on the Microsoft Windows XP Embedded Platform, which it describes as powerful and highly scalable. The co. says the software provides maximum performance for mission-critical applications and a real-time, global view of a packaging line, with standards-based architecture designed to work seamlessly with equipment and allowing users to leverage existing technology investments.

SYSTECH International, 609/235-8408. www.systech-tips.com

Sign up for the Packaging Digest News & Insights newsletter.

You May Also Like