Food Safety Summit resource center at PACK EXPO unites packaging, processing and food safety

With leading experts on hand to address food safety themes and specific questions, the Food Safety Summit Resource Center at PACK EXPO International 2010 (McCormick Place, Chicago; Oct. 31–Nov. 3) will help manufacturers and processors respond to the challenges they face on the job.

The Food Safety Summit Resource Center gives attendees a forum to discuss their specific food safety challenges, learn about the latest breakthroughs and gain insight into potential solutions. “To ensure safety in this era of global supply chains and increased automation, manufacturers need stricter controls in product processing, packaging, transport and handling,” says Charles D. Yuska, president and CEO of PMMI, sponsor and producer of PACK EXPO. “The Food Safety Summit Resource Center will connect PACK EXPO attendees with leading experts who can help them find solutions to critical challenges.”

The experts on hand will make formal presentations on leading food safety issues including foreign material detection, sanitation, traceability, hygiene, interventions and analytics.

Confirmed presenters include  AcryliCon Industrial Flooring, Afilias Discovery Services, Alchemy Systems, Applied Robotics, ConAgra Foods, DayMark Safety DNV,Systems, Integrated Resources, ITW, Ingersoll-Rand, Invensys, Kestrel Management, Loma Systems, Michigan State University,  MOCON, The National Food Lab, Northwest Analytical, Inc., PakSense, Inc., Qualtrax, Siemens Security Solutions, Specialized Technology Resources, Steritech and TraceGains.

The Food Safety Summit Resource Center will be located in Booth E-7040 in the Lakeside Center in the East Building. For more information or to register for PACK EXPO International 2010, visit www.packexpo.com or contact PMMI’s Show Department at 703.243.8555 or [email protected].

SOURCE: PMMI

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