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Pack Expo 2002: All roads lead to Chicago

Chicago is definitely the place to be in early November, as companies representing every sector of the packaging marketplace gather for the biennial Pack Expo International. Exhibits will feature the most up-to-date technologies in packaging machinery, converting machinery, materials, packages and containers, controls and software, machinery components, robots and services. The exhibits will cover more than 1 million square feet at McCormick Place, which will be trod by 50,000 packaging buyers.


A truly international event, the show attracts attendees from more than 60 countries, representing the food, beverage, pharmaceutical/medical, chemical/household, toys/games, computer and converting market sectors. Pack Expo is sponsored by the Packaging Machinery Manufacturers Institute.

Co-locating with Pack Expo is the International Exposition of Food Processors, bringing the newest developments in processing technologies for the food and beverage industry. IEFP is sponsored by the Food Processing Machinery & Supplies Assn.

Advance registration for the show (before Oct. 11) is $15; on-site registration is $30. Fees include attendance at both shows. For further information on the show or registration, visit www.packexpo.com, or call PMMI at 703/243-8555. Housing and travel information is also available at the website.

Registration/informationAdvance registration (before Oct. 11) for the exhibits only is $15; on-site registration is $30. Charges for the conference sessions are listed at right. For further information on the show, contact PMMI at 703/243-8555 or visit www.packexpo.com.

Show dates and hours are Sunday, Nov. 3 through Wednesday, Nov. 6, 9 a.m. to 5 p.m. and Thursday, Nov. 7, 9 a.m. to 2 p.m.

A complete preview of exhibits will appear in the October issue of Packaging Digest. See the accompanying sidebar articles on other activities to be held during Pack Expo week, including the Conference at Pack Expo, featuring more than 50 informational sessions and three morning plenary addresses.
Circle No. 245.



Conference schedule is 'packed'
More than 50 conferences and three eye-opener plenary sessions are planned for Monday through Wednesday of Pack Expo week. The daily plenary sessions are open to all attendees by registering at www.packexpo.com; the fee is $25, but conference registrants pay no additional fee. Charges for the conference program, received on or before Oct. 11, are $225 for a single morning, $475 for the full conference (all three days). After Oct. 11, the fees are $275/$550.

The eye-opener session from 8 to 8:45 a.m. Monday is Package Identification, Today and Tomorrow: Advancing Toward a Global Coding Standard by Charles F. Williams, Georgia Pacific Corp. Tuesday's topic is The Evolving Global Packaging Market: Directions, Challenges and Drivers of Change by Tim Rothwell and Ken Brooks of Ernst & Young Corporate Finance. Wednesday's session is a panel discussion on Understanding and Meeting the Packaging Requirements of Mass Merchandisers and Club Stores, by Ronald Reed of Wal-Mart Stores, Jay Gouliard of General Mills, Jack Nock of Osram Sylvania Products, and William Donohue of Automated Production Systems.

Each morning's conference schedule has four concurrent tracks, organized by subject matter. Each track has five sessions: 9 to 9:45 a.m., 9:45 to 10:30 a.m., 10:45 to 11:30 a.m., 11:30 to 12:15 p.m., and 12:15 to 1 p.m. Registrants choose which track they prefer to attend. For complete details on each conference session, visit www.packexpo.com.

Monday, Nov. 4
Market Insights:
Material and Machinery Advances–Driving Forces Behind Consumer Goods Packaging Innovations by K. Barnes, Packform Ltd., and L. Dornblaser, Global New Products Database; Brace Yourself for More Packaging Industry Consolidation by D. Butler and R. Billow, Billow Butler and Co.; Barrier Needs–At the Core of an Innovative Package Development Process by M. Stevens, MOCON; Rigid Packaging Technology Advances that Differentiate Products, Grow Brand Sales by D. Abramowicz, Crown Cork & Seal; and Design and Its Impact on PET Beverage and Food Container Performance by R. Hubbard, Schmalbach-Lubeca Plastic Containers.

Innovative Operations:
Beyond the Brown Box–Understanding and Satisfying the Very Different Corrugated Case Demands of Club Stores/Mass Merchandisers and Drink Pouch Packagers by B. Goodman, Goodman Packaging; Speeding to Market with 3-D CAD Package Design by B. Dahl, Haumiller Engineering, and J. Osman, SolidWorks; Gantry Robotics: From Stodgy to Speedy...How the Black Sheep of the Robotics Industry is Changing the Palletizing and Order Fulfillment Paradigm by B. Torrens, RMT Engineering; New Automatic Guided Vehicle Systems (AGVS) Technologies and How They Benefit Packaging Operations by B. Keiger, Transbotics Corp., and K. Gantt, Universal Manufacturing and Logistics; and Leveraging Design/Build For Faster, Better, Cheaper Packaging/Processing Lines by M. Shambaugh, Shambaugh & Son, R. Calamari, Frito Lay, and C. Kreikemeier, Sverdrup Industries.

Closure Considerations:
What's New in Child-Resistant, Adult-Friendly Closures by M. Fricke, Kerr Group, and an end user co-presenter to be announced; Tooling for Plastic Closures: Injection vs Compression by A. Edlund, Marland Mold; Dispensing Closures–More Choices and Better Functionality by R. Krishna, Owens-Illinois, and an end user co-presenter to be announced; Choosing the Right Liners and Sealing Systems for Plastic, Metal and Composite Closures by B. Radek, Selig Sealing Products; and Tamper Evidence and Total Product Integrity in a Changing Global Marketplace by J. Watts, Portola Packaging.

Boosting Productivity:
Distribution Center Packaging in a Global Environment by W. Armstrong, Sealed Air; Wireless Control of Packaging Operations by K. Kersten, Rockwell Automation; Eliminating Production Bottlenecks and Improving Efficiency with Root Cause Video Recording by K. Hilden and D. Lanthier, both of Papertech, Inc.; Networking Machine Vision to Improve Packaging Process Controls by M. Helman, Cognex; and Advance X-Ray Inspection–Making Routine Work Out of Formerly Impossible Weighing and Counting Tasks by K. Bloomfield, Tellico Harbor Consulting, and W. Knigge, General Mills/retired.

Tuesday, Nov. 5
PLCopen/OMAC: Controls:
Mechatronic Packaging Equipment, the PLCopen and the Rationale for a Motion Control Library by E. van der Wal, PLCopen; The Pros and Cons of Implementing the Standard by H. Claussnitzer, Parker Hannifin; Packaging Machinery Empowerment in the Global Marketplace by C. Korte, Optima Filling and Packaging Machines, and R. Klieverik, Optima USA; Discovering the Benefits of Open Modular Architecture Controls by R. Lidington, R.A. Jones; 'Plug and Pack' Packaging Machinery–a Progress Report by F. Putnam, consultant, Markem; and How P&G Plans to Profit from the OMAC Guidelines for Packaging Machinery by R. Aleksa, Procter & Gamble.

Next Generation Packages:
The Retortable Paperboard Carton Gets Ready to Enter the U.S. Market by A. Dun, Tetra Pak; Packaging Challenges of the Single Parcel Environment by C. Thompson, United Parcel Service; Hardening the Packaging Supply Chain Against Attack by R. Dillon and J. Noferi, Pharmacia; and Are your Packages Adequately Tamper Evident? by E. Arling and R. Dillon, Pharmacia.

Boosting Productivity:
Debunking the Packaging Line Efficiency Myth by M. Garvey, Garvey Corp.; Strategies for Automating and Integrating Manufacturing and Packaging Lines by J. Aspinall, Multivac, C. McIvor Sr., Medtronic MiniMed, and R. Vatterott, Rapid Development Services; New Developments in Aseptic Bottling of Fruit Juices, Isotonics and Dairy-Based Drinks by L. Baiocchi, Procomac, and D. Blair Sr., Tropicana Products; and Toward Pasteurizable PET Bottles–The Newest Beverage Packaging Goal by A. Fioravanti, Constar.

Operational Advances:
QCP–Faster, More Accurate Changeovers by P. Zepf, Zarpac; Shrink Wrapping as a Cost-Saving Strategy by E. Cerf and R. Aylor, both of Polypack; Advances in Laser Package Marking and Scoring by G. Smith, Linx Xymark; Laser Processing of Flexible Packaging for Improved Quality and Customer Convenience by C. Chow, Converting Market for Laser Machining; and Direct Laser Coding Technology–Packaging Professionals' Choice for the Present and the Future by S. Assa, Laserink.

Wednesday, Nov. 6
Packaging Post 9/11:
A Post 9/11 Analysis of Packaging's Role in Product Safety and Liability by Eric F. Greenberg, Attorney-at-Law, Ungaretti & Harris, and legal editor, Packaging Digest; Upgrading Your Food and Beverage Packaging Operations with the Application of Clean Room Technology by P. Consitt, Operational Innovations; "Producer Pays" and Other Global Environmental Mandates by V. Bell, Environmental Packaging Intl; Packaging Security and the Role of Induction Sealing in a Safety Conscious Society by Bill Zito, Enercon Industries, and J. Pitassi and M. Miramonti, GlaxoSmithKline; Choosing the Right Anti-Counterfeiting Technology for Your Packaging Format by G. Hoenig, Tadbik Advanced Technologies.

New Material Choices:
Bio-Based Materials–A Reality in the Packaging Industry by N. Whiteman, Cargill Dow; Evaluating Metal Can and Glass Container Alternatives for Food by T. Osip, ConAgra Foods, Grocery Products Co.; Concave End Pressurized Thin Wall Steel Cans–Grace Under Pressure with 40% Less Steel by M. Springer, Ingenium Packaging; Steel Shipping Platforms–How Harley Takes its "Hogs" to Market While Reducing Costs and Environmental Impact by B. Ledbury, Harley-Davidson Motor Co., and L. Nielsen, Worthington Steelpac Systems; and Assessing the Latest Advances in Shrink Sleeve Label Films by S. Van Winter, Ivex Packaging.

Boosting Productivity:
Applying the Lean and Agile Manufacturing Process Simulation Model to Packaging Operations by P. Helm, Lockwood Greene Engineering; Automating Packaging Machinery with the Use of Servo Technology by D. Throne, Bosch Rexroth; Improving Packaging Operations Performance Through Safety Management by M. Crickenberger, DuPont Safety Resources; Leveraging Integrated Motion Control for Throughput, Speed, and Flexibility by D. Burns and B. Hirschinger, both of Rockwell Automation; and Leveraging Coding Technology to Cut Costs While Boosting Efficiency and Improving Supply Chain Management by S. Liniger, Videojet Technologies, and B. Pierannunzio, PPG.

Pouching Advances:
Non-Destructive Inspection of Heat Sealed Retort Pouches by Airborne Ultrasound by T. Stauffer, PTI-Packaging Technologies & Inspection; Integrating Pouch Technology into a High-Speed Efficient Filling and Packaging System by B. Emden, Sidel Packaging Systems; Making the Reclosable, Spouted Pouch a Beverage Market Reality by B. Hare, Curwood; Enhanced Productivity Solutions with Continuous-Motion Stand-Up Pouch Machinery by D. Calamusa, ALLIEDFLEX Technologies, and a snackfoods manufacturer to be announced; and Innovations in Retort Pouches by R. Stern, CLP Industries Ltd., D. Polvino, Stock America, and G. Caligiuri, Sunny Dell Foods.


 

Eastman Kodak named Packaging Leader of the Year
The Packaging Education Forum has recognized Eastman Kodak Co. as its Packaging Leader of the Year. The award cites Kodak's many customer-responsive packaging innovations; the ingenuity, dedication and hard work of their packaging team; and Kodak's staunch support of college-level packaging education, especially at its hometown school, Rochester Institute of Technology (RIT).
The Packaging Leader of the Year award will be presented Nov. 5 from 5 to 8 p.m.
Two of Kodak's packaging innovations, for x-ray film, above, and Kodak Max, below.
at a ceremony in the Vista Ballroom of McCormick Place, during Pack Expo.
Under the direction of Jim Scott, director, package engineering & graphics design, Kodak has introduced the following innovative concepts:

• Trade-channel-specific packages for films, including composite cans for refrigerated vending machine sales of single-use cameras, pegboard displayed cartons for convenience stores and supermarket checkout sales, and eight-pack cubes for clubstore sales;

• Test market evaluations of standup flexible pouches for film sold in Canadian drug chain outlets;

• A bi-modal carton/integral clear plastic clamshell designed for a combination digital camera/mp3 player, with one primary facing for use in digital camera departments, the opposite side for music sections; and
Hall of Fame announced
As this issue was going to press, the Packaging Education Forum named the 2002 Hall of Fame inductees: Richard C. Botsch (posthumously), DuPont, Printpack; Kenneth J. Gollmann, Consolidated Packaging, Oden Corp.; Thomas E. Hogue, DuPont; Norman Nieder, Anheuser-Busch; and Charles E. Perrin, Eli Lilly, Creative Packaging, Dow AgroSciences. More information on the class of 2002 will appear next month.
• The DryView tray package for x-ray film, which incorporates an RF label that "communicates" with the x-ray printer, signaling the type of film in the tray.
Kodak has worked closely with RIT's packaging program and others that offer packaging curricula. Company officials have served on the advisory board to the RIT Packaging Engineering program for at least 10 years; they have also provided personnel as instructors for RIT's packaging and distribution courses.

Kodak created a model packaging co-op program so that students from RIT, Michigan State University and other schools can get hands-on, practical experience working with the company's packaging team. As many as 20 students have completed the Kodak co-op program in the past five years.

"As a Fortune 500 company in an extremely competitive business environment, it's extremely important that Kodak, as a company, listens and responds to its customers, not only through our products, but also through the packaging we create for every product," says Scott. "We are pleased and honored to be recognized by the PEF for our efforts to meet the needs of our customers to educate our future packaging professionals."

PEF's president, Ben Miyares, comments: "Eastman Kodak is an excellent example of how corporations can balance packaging innovation with support of education and training. Kodak recognizes that packaging supports the company's profitability and that investing in students today can pay off with future packaging innovations, and they will be applauded for their efforts."

Students win Italy trip
Earlier this year, six packaging students were named winners of the inaugural Italian Packaging Technology Award. Selected on the basis of an essay addressing either packaging machinery or materials, the students spent two weeks in June visiting 10 of the most technologically advanced packaging suppliers in Bologna, Parma and Milan, Italy.

At the PEF reception, the Italian Trade Commission, UCIMA (the Italian Association of Automatic Packing and Packaging Machinery Manufacturers) and PEF will announce sponsorship of the second technology award to be announced next year.
The six winners of the Italian Packaging Technology Award who enjoyed a two-week trip to Italy in June are, from left: I-Kon Chen, California Polytechnic State University; Dustin Armstrong, Mohawk College of Applied Arts and Technology; Melisa Balkorn, Unviersity of Florida at Gainesville; Thomas Berry, Clemson University; Bridget Archibald, Virginia Polytechnic Institute and State University; and Matthew Mulvey, Rutgers University.
According to Paola Bellusci, trade commissioner at the Italian Trade Commission in Chicago, "The aim is to awaken interest in future packaging professionals. We are confident it will become an annual award. We consider the success of the initiative to be a brilliant opportunity to get in touch with the Italian packaging industries. The trip gives the students the experience of seeing the flexibility and capacity of the Italian companies to meet the packaging needs of the U.S. industry."
Also at the PEF reception, the 2002 Packaging Hall of Fame members will be introduced (see announcement, above). And, the winner of this year's Sarah Lee Gerrish memorial scholarship, also based upon an essay, will be announced. More on that in a subsequent issue of PD.

Proceeds from the PEF event support packaging education programs in the U.S. and Canada. For information on tickets, which cost $150 each, contact 703/243-5717 or [email protected].


 

Pharmaceutical/medical plays visible role at Pack Expo
While U.S. capital spending for packaging machinery is expected to increase modestly this year, at about 1.5 percent to 2.5 percent, spending by pharmaceutical and medical companies is predicted to increase much more, by 8 percent to 10 percent. The estimated dollar amount is $594 million, or 11.9 percent of all packaging purchases. Personal care product companies are expected to increase packaging machinery purchases by 2 percent to 4 percent, or about $300 million. This information is gleaned from the 2002 Purchasing Plans Study from the Packaging Machinery Manufacturers Institute (see PD, May, '02, p. 68 for full report).
A further report from PMMI, the 2001 Shipments & Outlook Study, shows that shipments of packaging machinery should grow at a cumulative rate of 3.0 percent through '03, reaching a value of $5.4 billion. In '00, the study points out, pharmaceutical/medical companies accounted for 8.9 percent of all shipments. In Canada, that figure is 20 percent for pharmaceutical companies (see PD, Dec., '01, p.44, and Jan., '02, p. 52, for the full report).

Because of the healthy prognosis for pharmaceutical and medical packaging machinery, it is no surprise that many exhibitors at Pack Expo will be addressing the needs of that market. To complement this issue focusing on Pharmaceutical and Medical Packaging, below is a list of exhibitors at Pack Expo that have indicated they serve the pharmaceutical/medical packaging market. A complete preview of Pack Expo exhibitors will appear in our October issue.

Accu-Sort Systems, E-7908, is showing its small scanner line and the Adaptascan.

All-Fill, S-217, has a new VC series volumetiric cup filler and B-600 auger filler with Allen-Bradley PLC.

AISI Automation Industrielle, E-6362, is showing tubes and molding/forming equipment. Circle No. 48.

Banner Engineering, N-5802, has the new Pico-Guard™ fiberoptic safety system, Presence Plus™ Pro vision sensor and World-Beam™ laser-diffuse sensors. Circle No. 123.

Capmatic, S-2837, has a new Patriot™ family with automatic loading of "micro tubes." Circle No. 12.

Cognex, E-6553, exhibits its In-Sight machine vision sensors. Circle No. 75.

Cozzoli Machine, N-3813, has batch washers, fillers/stoppers and a mini monoblock.

CVC Technologies, E-6976, see a complete line of labeling machines.

Diagraph, S-2366, has a new IJ/3000 large-character ink-jet and ALP/4500 label printer/applicator.

Dibipack USA, E-6732, is showing the "one-step" shrink system that does the work of an L-sealer and shrink tunnel.

Doyen Medipharm, S-760, for contract packaging services of medical products.

Drug Plastics & Glass, S-3075, features bottles, jars, caps and closures.

DT Packaging, S-1466, has a new all-servo blister packaging machine. Circle No. 70.

DuPont, E-8001, exhibits the next generation of holographics for security and packaging impact.

Enercon Industries, S-874, is showing the new Super Seal Deluxe™ with "all-in-one" quick-change sealing head design and new remote communications package. Circle No. 118.

Fortress Technology, E-7051, full line of Phantom metal detectors.

Griffin-Rutgers, N-3114, shows the Metronic line of inPRINT UV web printers.

HealthStar, S-654, is a supplier of pre-owned, rebuilt packaging and processing equipment.

IMA North America, E-6916, for a new ERGO continuous-motion horizontal cartoner and Electrofill continuous-motion filler.

Ivex Protective Packaging, E-8123, offers custom converting and new Jet-Lite Poly flexible mailers.

Klöckner Bartelt, S-812, shows a new double bag clamp machine and new bagmaker with zipper system on roll-up cart. Circle No. 42.

Klöckner Pentaplast, E-7066, features new Pentapharm® ACLR® S03 barrier film and new Pentafood® FD-M180/14 corona-treated vinyl film. Circle No. 20.

Lepel, S-972, "self-cooled" induction sealer with no fan, no vents and no water.

Lock Inspection, S-1142, launches the Met30+ 3f metal detector with large electroluminescent touchscreen interface.

Loma Systems, S-334, for the new AXIS Mark III x-ray system.

Marchesini Packaging Machinery, E-7016, offers blister and deep-draw thermoformers, sterilizing equipment and tube fillers, among others.

McBrady Engineering, S-2152, for the Orbit bottle rinser/clearner.

Multivac, E-8504, live demonstrations show the R530 thermoform/fill/seal rollstock system and T200 tray sealer.

New England Machinery, S-2456, offers a rotary chuck capper that assists in torque verification and validation. Circle No. 64.

NJM/CLI, N-3806, features the new FLX 1200 liquid filler with modular design. Circle No. 85.

Optima Machinery, N-3241, shows the inova pharma system that handles 4500 syringes/hr.

Packworld USA, N-3245, for validatable impulse heat sealers and benchtop press systems. Circle No. 40.

Packaging Technologies & Inspection, S-1943, introduces the new non-contact airborne ultrasonic inspection system.

Pillar Technologies, S-2119, shows the new highest-speed "waterless" induction cap-sealing system.

Safeline, X-721, offers a full line of inspection equipment.

SMI S.p.A., N-3861, for the LSK 45 automatic shrink wrapper in three models. Circle No. 41.

Süd-Chemie Performance Packaging, N-3104, offers moisture-control solutions and desiccant bags.

SV Research, N-4247, SV Reader and SVClinical for verification inspection.

Thermo Electron, S-1501, newly formed weighing and inspection group's checkweighers, metal detectors and x-ray inspection equipment. Circle No. 77.

Uhlmann Packaging Systems, N-3672, showcases its high-speed thermoformer, cartoner, overwrapper, case packer and palletizer.

Weiler Engineering, S-660, offers advanced aseptic liquid processing technology for parenteral manufacturing. Circle No. 59.
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