Quik-Pak Offers Free Plastic IC Packages for Assembly Customers

Quik-Pak, a leader in quick-turn IC prototype packaging and assembly, is offering complementary open-cavity plastic packages (OCPP) for a limited time on prototype IC assembly orders. Through March 31, 2009, any customer who sends wafers or die to Quik-Pak for assembly will receive open-cavity plastic packages at no charge.

"We value our customers' loyalty to Quik-Pak," says Steve Swendrowski, General Manager. "We want to express our appreciation in a way that will help them succeed." This special pricing is offered to new and current customers.

Quik-Pak has a patented, proprietary process that takes customers' packages and reconfigures them for the assembly of the new die into the same package. The company says it has an extensive inventory of package configurations to meet specific customer applications. The packages are said to be identical to packages that will be used in high-volume production, thus eliminating the performance variables that are introduced by using non-production packages for prototype devices.

Source: Quik-Pak a division of Delphon

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