March 11, 2015
PACK EXPO 2013
Manufacturers in the pharmaceutical, biopharmaceutical, nutraceutical and medical device industries are facing significant challenges in 2013, including a shifting regulatory landscape, downward pricing pressures and escalating attention to product safety measures.
However, players in this highly scrutinized industry must also continue to advance their operations in order to remain competitive and capitalize on expanding opportunities in emerging markets. PACK EXPO Las Vegas 2013 (September 23-25; Las Vegas Convention Center, Las Vegas, NV) will feature the latest technologies and a range of education opportunities to help these industry professionals overcome challenges and drive growth.
Now in its third year, The Pharmaceutical Pavilion will highlight the latest advances in equipment and materials such as labeling technologies, filling and inspection systems, blister packaging, tubes and closures. In addition to The Pharmaceutical Pavilion, The Rx Lounge, endorsed by the International Society for Pharmaceutical Engineering (ISPE), will offer a place for brand owners to network and exchange ideas with colleagues and key decision makers. The ‘Ask-the-Experts' Forums, staffed by representatives from ISPE, will give attendees an opportunity to seek advice on how to resolve packaging and processing-related challenges.
Attendees will also have access to a series of on-floor education sessions at the Innovation Stage. These free presentations are scheduled to run each day of the show and will include a variety of topics relevant to the pharmaceutical and medical device industry. Details about this programming will be announced in the coming weeks.
Several other specialized pavilions round out the resources available to pharmaceutical attendees. The Brand Zone will showcase packaging materials - including blister and tamper-evident solutions and innovative labeling applications to ensure consumer safety. The Processing Zone will provide a hub for the latest processing equipment. In addition, many processing solutions will also be found throughout the show floor.
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