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Printed electronics agreement advances packaging, The Internet of Things Jul 21, 2014 Printed electronics supplier Thinfilm signs an agreement that integrates cloud software, Near-Field Communication (NFC) and physical... Sign up for the Packaging Digest News & Insights newsletter. Select Country GO Receive Marketing UpdatesWe may wish to contact you regarding future events and products including Packaging Digest, please uncheck this box if you do not wish to receive these updates. I would like to hear about related events and products, including future editions of Packaging Digest. *SelectYesNo Receive Third Party CommunicationsPackaging Digest' carefully selected third party partners may wish to contact you. Please uncheck this box if you do not wish to receive these communications. I would like to hear from Packaging Digest's carefully selected third parties. *SelectYesNo You may withdraw your consent to receive any of our communications at any time. You understand that your information will be used in accordance with the Privacy Policy. Agree to Terms Enter your email above to receive messages about offerings by Informa, its brands, affiliates and/or third-party partners, consistent with Informa's Privacy Statement. List Leave this field blank